In standard Statistical Process Control (SPC) textbooks, subgroup sizes are typically recommended to be fixed at 3–5 samples.
This recommendation is based on an ideal assumption: each production batch or time interval yields the same number of samples.
However, in real manufacturing environments, this assumption often does not hold.
Due to factors such as end-of-batch material shortages, sample loss, or varying time windows in high-frequency automated data collection, subgroup sizes (n) frequently fluctuate.
Limitations of Traditional SPC Tools
When faced with variable subgroup sizes, traditional Excel templates or entry-level SPC software usually fail—either producing errors or requiring manual data splitting and padding.
Such workarounds not only distort the authenticity of the data, but also obscure the true sources and structure of process variation.
Simple SPC provides full support for SPC analysis with non-fixed subgroup sizes using statistically sound and production-ready methods.
Accurately Capturing the True Voice of the Process
From a statistical standpoint, variations in subgroup size (n) directly affect the standard deviation of the subgroup mean.
For this reason, Simple SPC dynamically calculates the Upper and Lower Control Limits (UCL/LCL for each individual data point, based on the actual subgroup size of that point.
As a result, the control chart displays scientifically derived stepwise control limits, ensuring that out-of-control detection for every subgroup is statistically rigorous, consistent, and reliable, even when subgroup sizes fluctuate.
For processes with fluctuating subgroup sizes, the system provides a complete set of statistical tools:
X-bar Chart
Monitors the process mean and central tendency.
R Chart / S Chart
Monitors within-subgroup variation.
When subgroup sizes vary significantly, the system recommends using the Xbar-S chart, as it utilizes all sample information more accurately to estimate process variation.
CPK / PPK
Distribution plots
Capability histograms
The figure below shows an SPC analysis report for a process with variable subgroup sizes generated by Our SPC.
Using the same dataset, the results were recalculated using the Simple SPC CPK Tool for verification and comparison.
The CPK Tool fully supports analysis based on variable subgroup sizes, ensuring consistency between SPC monitoring and capability evaluation.
Professional rigor is the bottom line for quality engineers.
To validate statistical accuracy, we input the same complex dataset with variable subgroup sizes into both Minitab and the Simple SPC 4.0 CPK Tool for parallel verification.
The results show that both systems produce completely identical outputs, including:
Control limits (UCL / LCL)
Mean values
Sigma estimates
Process capability indices (CPK, PPK)
This confirms that Simple SPC maintains industrial-grade statistical precision, while delivering a lightweight, fully digitalized experience through a browser-based (B/S) architecture with no client installation required.
·Process Control Methods for High Yield and Stable Volume Production:
In semiconductor manufacturing, the most dangerous issues are often not obvious out-of-spec events, but invisible and persistent process variations.
Wafer fabrication involves hundreds to thousands of tightly coupled process steps, each operating within extremely narrow process windows. Even a minor parameter shift can be amplified through downstream processes, eventually resulting in:
Yield degradation
Parameter distribution drift
Large-scale scrapping of high-value wafer lots
This reality determines that the semiconductor industry cannot rely on end-of-line inspection to ensure quality. Instead, it must continuously answer two critical questions during production:
Is the process stable?
Is the process still under control?
Statistical Process Control (SPC) exists precisely to address these questions and has become a foundational capability in modern semiconductor manufacturing.
Unlike traditional manufacturing, SPC in semiconductor fabs is not merely a statistical tool used by quality departments. Instead, it serves as:
A daily monitoring method for process engineers
A key reference for equipment and process condition assessment
A critical input for yield management and production release decisions
In practice, SPC is typically integrated with MES/EAP/FDC/APC systems, forming a comprehensive process control framework that supports:
Early identification of process drift
Proactive exception handling in advance
Support process and equipment decisions

Lithography is one of the most yield-critical steps in semiconductor manufacturing. SPC is commonly used to monitor:
Critical Dimension (CD)
Overlay
Dose
Focus
Given the extreme sensitivity of lithography parameters to yield, semiconductor fabs focus heavily on subtle trend shifts rather than obvious limit violations. Therefore, SPC applications often combine:
I-MR control charts
EWMA and CUSUM trend detection methods
to enable early detection of ”chronic loss of control“.
In etching processes, SPC is primarily applied to monitor:
Etch depth
Line width variation
Within-wafer and wafer-to-wafer uniformity
Continuous SPC monitoring helps engineers identify:
Chamber condition changes
Consumable aging and contamination risks
Process parameter drift
thereby reducing the risk of batch-level excursions.
Typical SPC monitoring parameters in deposition processes include:
Film thickness
Refractive index
Resistivity
Uniformity
SPC is used not only for single-tool stability control, but also widely applied in:
Tool matching across multiple equipment sets
Maintenance and cleaning interval optimization
CMP processes are characterized by high process noise and complex parameter coupling. SPC monitoring focuses on:
Removal rate (RR)
Surface roughness
Planarity metrics
By applying SPC, fabs can distinguish random variation from systematic drift, preventing long-term yield loss caused by cumulative deviations.
In front-end manufacturing, SPC is applied not only to process parameters, but also extensively used for:
Monitoring key electrical characteristics
Analyzing yield trend indicators
This allows engineers to trace yield anomalies upstream to specific process steps, enabling faster root-cause identification.
Compared to traditional manufacturing, semiconductor SPC exhibits distinct characteristics:
Single-point or very small subgroup sampling
High-frequency monitoring
Non-normal distributions are common
Skewed and long-tailed characteristics frequently observed
As a result, practical SPC applications often require a combination of:
Data transformation methods
Trend-based control charts
Non-normal analysis strategies
In semiconductor manufacturing, the most significant risks typically arise from:
Long-term, gradual, and continuous process drift
Therefore, the core value of SPC lies in early trend detection, rather than reacting only after parameters exceed control limits.
Through systematic SPC implementation, semiconductor manufacturers can:
Detect process instability early and protect yield
Reduce the risk of scrapping high-value wafers
Support equipment maintenance and process optimization decisions
Improve consistency and stability across tools and production lines
In advanced process nodes, SPC has become a key reference for process release and stable mass production.

In the semiconductor industry:
Invisible variations are often the greatest risk.
SPC is not merely a set of statistical charts, but a comprehensive process control methodology designed to:
Continuously monitor process conditions
Detect abnormal trends at an early stage
Safeguard yield and stable volume production
Simple SPC is a privately deployed, browser-based Web SPC system designed for enterprise-level statistical process control.
No client installation is required—users can access the system directly through a standard web browser.
Bingo SPC has been recognized for three consecutive years as a “Recommended SPC Software” by SoftServe Home (软服之家), a leading Chinese enterprise software evaluation platform.
Once the quality data is fully and automatically collected, all the data is stored in our SPC system, each inspection item can generate a complete SPC analysis report with a single click, including:
As manufacturing digitalization advances, dashboards are widely used on the shop floor to produce production status, such as order progress and workstation load.
Quality management follows the same visualization approach by:
The anomaly detection item list notification has been upgraded to allow configuration of different notification object groups based on the detection item category.
We often need to periodically analyze SPC process data for various testing items, or compare process data from different testing items. A fast statistical tool is essential.
ü Define start and end dates
ü Aggregate by year, quarter, month, week, or day
The SPC system stores a lot of testing data. Some testing items from common sources may be correlated. Generally, we organize this testing data and use Minitab or Excel to perform correlation and regression analyses in pairs, adjusting the lag period to find the optimal antecedent effects. However, a more efficient method is essential:
This is an automatic weighing device. Each weighing sends weight data via a TCP server. We developed a small program:
ü Custom TCP client collects and synchronizes data to SPC system for real-time analysis
ü Different sources (machines A or machines B, shifts, lines, operators, etc.) tracked separately
ü Cpk comparison across sources
ü High-priority customers assigned to higher-Cpk production sources (the image below shows machines A and B).
ü Large amounts of data have been collected in the data center. Data is directly linked to the database and synchronized to the SPC software.
ü SSO
ü Token-based URL access
ü Supports 11 languages: English, Simplified Chinese, Traditional Chinese, Thai, Japanese, Vietnamese, Korean, Indonesian, Spanish, Hindi, and Malay.
ü Support:Unlimited users, inspection items, and dashboards
ü Alarm notifications via: Email、API、Enterprise WeChat、DingTalk
ü Customizable SPC report templates
ü Custom alarm notification recipients
More Powerful. More Efficient. Built for Complex Quality Scenarios.

Following its recognition as a Recommended SPC Software in 2025, Bingo SPC is proud to announce the official release of SPC 4.0 in early 2026.
This major upgrade represents a significant leap forward—not only in statistical rigor, but also in operational efficiency, system scalability, and enterprise-grade usability. SPC 4.0 is designed to support more complex manufacturing scenarios while delivering faster insights and stronger process control.
SPC 4.0 Is Ready
SPC 4.0 is now fully available.
We recommend starting with the enhanced CPK six-in-one analysis report and the new Statistical Dashboard to experience the most significant improvements firsthand.
In the pharmaceutical industry, the consequences of quality issues extend far beyond economic loss. They directly affect patient safety and expose companies to significant regulatory and compliance risks.
Compared with other manufacturing sectors, pharmaceutical production has several defining characteristics:
Highly complex processes with numerous variables
Extremely stringent quality requirements with minimal allowable variability
Any abnormality may result in batch rejection, production shutdowns, or product recalls
Strict regulatory oversight under frameworks such as GMP and authorities including the NMPA, FDA, and EMA



As a result, the core challenge of pharmaceutical quality management is not simply whether a product meets specifications, but whether:
This is precisely where Statistical Process Control (SPC) delivers its fundamental value in the pharmaceutical industry.
In pharmaceutical manufacturing, SPC is far more than a basic statistical quality tool. It serves as:
A critical method for maintaining continuous process control
A key data foundation within GMP systems
A vital bridge connecting processes, equipment, quality, and regulatory compliance
By continuously monitoring Critical Process Parameters (CPPs) and Critical Quality Attributes (CQAs), SPC enables pharmaceutical companies to:
Detect abnormal trends at an early stage
Prevent deviations from escalating into quality incidents
Provide objective, data-driven evidence for deviation investigations and CAPA activities
In active pharmaceutical ingredient (API) and finished dosage manufacturing, SPC is commonly applied to monitor:
Key physicochemical attributes of raw and excipient materials
Particle size distribution and moisture content
Weighing accuracy and variability
SPC allows early identification of abnormal fluctuations in raw materials or pre-processing steps, preventing issues from propagating downstream into subsequent processes.

In solid and liquid dosage form manufacturing, SPC is widely used to monitor:
Mixing time and blend uniformity
Tablet weight, hardness, and thickness
Fill volume accuracy and sealing quality
SPC helps distinguish between:
Random variation, and
Systematic shifts or equipment-related abnormalities,
thereby reducing batch-to-batch variability and ensuring consistent product quality.

For sterile products and biopharmaceutical manufacturing, SPC plays a particularly critical role in monitoring:
Environmental conditions (temperature, humidity, microbial levels, particle counts)
Sterilization process parameters
Operating status of critical equipment
Trend-based control charts enable early detection of potential loss-of-control conditions, helping prevent sterility failures before they occur.

During the packaging stage, SPC is commonly applied to:
Fill consistency
Seal integrity
Label positioning and readability
Effective process control at this stage significantly reduces compliance risks related to mislabeling, underfilling, or packaging defects.

SPC data is frequently used to support:
GMP audits and inspections
Deviation investigations
Verification of CAPA effectiveness
By translating abstract GMP requirements into measurable and continuously monitored process indicators, SPC plays a critical role across all quality assurance activities. Data integrity, traceability, and audit readiness are especially essential.
In pharmaceutical manufacturing, many quality risks do not arise from isolated out-of-specification events, but from:
Gradual and long-term process drift.
SPC trend analysis enables proactive intervention before deviations formally occur.
SPC is often implemented in conjunction with:
Process Validation (PV)
Continued Process Verification (CPV)
forming a core component of lifecycle process management.
Improved process stability and product consistency
Reduced risk of batch deviations and product rejection
Stronger support for GMP compliance and regulatory audits
More efficient deviation handling and CAPA execution
Establishment of a data-driven quality culture
As regulatory expectations continue to increase, SPC has evolved from an optional tool into a foundational capability within pharmaceutical quality systems.
In the pharmaceutical industry:
Compliance is the baseline. Stability is the core. Data is the safeguard.
Through continuous monitoring and trend analysis, SPC enables manufacturers to take action before problems occur—protecting patient safety, reducing operational risk, and supporting long-term, stable production.
Truly mature pharmaceutical manufacturing does not rely on end-product testing alone, but on controlled and predictable processes.